US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Protection liner on interconnect wire to enlarge processing window for overlying interconnect via" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,531, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Protection liner on interconnect wire to enlarge processing window for overlying interconnect via" was invented by Shin-Yi Yang (New Taipei, Taiwan), Hsin-Yen Huang (New Taipei, Taiwan), Ming-Han Lee (Taipei, Taiwan), Shau-Lin Shue (Hsinchu, Taiwan), Yu-Chen Chan (Taichung, Taiwan) and Meng-Pei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect fe...