US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 4 for "System, device and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,006, issued on Feb. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"System, device and methods of manufacture" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wei Ling Chang (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan) and Che-Wei Hsu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. ...