ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,020, issued on Feb. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Jiun-Yi Wu (Taoyuan, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Yu-Min Liang (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a circuit structure, a first redistribution layer, a second redistribution layer, a first encapsulant, a bus die and a plurality of through vias. The first redistribution layer is disposed over the circuit structure. The second redistribution layer is disposed over the first redistribution layer. The first ...