US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 4 for "Semiconductor image-sensing structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,164, issued on Feb. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor image-sensing structure and method for forming the same" was invented by Ming-Hsien Yang (Taichung, Taiwan), Wen-I Hsu (Tainan, Taiwan), Kuan-Fu Lu (Kaohsiung, Taiwan), Feng-Chi Hung (Hsin-Chu County, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Chun-Hao Chou (Tainan, Taiwan) and Kuo-Cheng Lee (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor image sensing structure includes a substrate having a first region and a second region, a metal grid in the first region, and a hybr...