US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 4 for "Packaged semiconductor device and method of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,089, issued on Feb. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packaged semiconductor device and method of forming thereof" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan) and Chih-Hang Tung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first die, a second die on the first die, and a third die on the second die, the second die being interposed between the first die and the third die. The first die includes a first substrate and a first interconnect structure on an active side of the first substrate. The second die includes a seco...