US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 4 for "Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,051, issued on Feb. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts" was invented by Cheng-Yuan Li (Kaohsiung, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan), Yun-Wei Cheng (Taipei, Taiwan) and Yen-Liang Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary embodiments for redistribution layers of integrated circuit components are disclosed. The redistribution layers of integrated circuit components of the present disclosure include one or more arrays of conductive contacts that...