US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "System and method for monitoring and performing thin film deposition" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,396, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System and method for monitoring and performing thin film deposition" was invented by Wen-Hao Cheng (Hsinchu, Taiwan), Yi-Ming Dai (Hsinchu, Taiwan), Yen-Yu Chen (Hsinchu, Taiwan) and Hsuan-Chih Chu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thin film deposition system deposits a thin film on a substrate in a thin film deposition chamber. The thin film deposition system deposits the thin film by flowing a fluid into the thin film deposition chamber. The thin film deposition system includes a byproducts sensor that senses bypro...