US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 3 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,395, issued on Feb. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Sheng-Chan Li (Tainan, Taiwan), I-Nan Chen (Taipei, Taiwan), Tzu-Hsiang Chen (Changhua County, Taiwan), Yu-Jen Wang (Kaohsiung, Taiwan), Yen-Ting Chiang (Tainan, Taiwan), Cheng-Hsien Chou (Tainan, Taiwan) and Cheng-Yuan Tsai (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front s...