US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Semiconductor devices and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,556, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of forming the same" was invented by Chia-Wei Su (Taoyuan, Taiwan), Yung-Hsu Wu (Taipei, Taiwan), Hsin-Ping Chen (Hsinchu County, Taiwan), Chih Wei Lu (Hsinchu, Taiwan), Wei-Hao Liao (New Taipei, Taiwan), Hsi-Wen Tien (Hsinchu County, Taiwan) and Cherng-Shiaw Tsai (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes the following operations. A substrate is provided with an electric component. A composite dielectric layer is formed on the substrate and...