US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Semiconductor devices and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,612, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of forming the same" was invented by Chao-Wei Chiu (Hsinchu, Taiwan), Jen-Jui Yu (Taipei, Taiwan), Hsuan-Ting Kuo (Taichung, Taiwan), Cheng-Shiuan Wong (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including the use of solder materials and methods of manufacturing are provided. In embodiments the solder materials utilize a first tensile raising material, a second tensile raising material, and a eutectic modif...