US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Immersion cooling fin assembly and immersion cooling system for two-phase immersion cooling" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,293, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Immersion cooling fin assembly and immersion cooling system for two-phase immersion cooling" was invented by Tse-Hsien Wu (Hsinchu, Taiwan), Chyi-Tsong Ni (Hsinchu, Taiwan) and Che-Yu Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coolant system including one or more cooling fin assemblies that are movably coupled to a coolant tank. Each one of the one or more cooling fin assemblies has a first position (i.e., closed position) in which the one or more cooling fin assemblies are slightly tilted with respect to inner sides of...