US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 3 for "Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,553, issued on Feb. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes" was invented by Chen-Hung Tsai (Hsinchu, Taiwan), Chao-Hsun Wang (Taoyuan County, Taiwan), Pei-Hsuan Lee (Taipei, Taiwan), Chih-Chien Chi (Hsinchu, Taiwan), Ting-Kui Chang (New Taipei, Taiwan), Fu-Kai Yang (Hsinchu, Taiwan) and Mei-Yun Wang (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a source/drain component of a transistor. A source/drain contact is disposed over the source/drain component. A so...