US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Chemical mechanical polishing cleaning system with temperature control for defect reduction" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,524, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chemical mechanical polishing cleaning system with temperature control for defect reduction" was invented by Ssutzu Chen (Hsinchu, Taiwan), Ying-Tsung Chen (Hsinchu, Taiwan), Ya-Ting Tsai (Hsinchu, Taiwan), Gin-Chen Huang (Hsinchu, Taiwan) and Kei-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system f...