US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Adding sealing material to wafer edge for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,604, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Adding sealing material to wafer edge for wafer bonding" was invented by Yu-Yi Huang (Taipei, Taiwan), Yu-Hung Lin (Taichung, Taiwan), Wei-Ming Wang (Taichung, Taiwan), Chen Chen (New Taipei, Taiwan), Shih-Peng Tai (Xinpu Township, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first e...