US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 25 for "Semiconductor structure and method for forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,235,490, issued on Feb. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Wei-Kang Liu (Taichung, Taiwan), Lee-Shian Jeng (Hsinchu, Taiwan), Chih-Tsung Shih (Hsinchu, Taiwan), Hau-Yan Lu (Hsinchu, Taiwan) and Yingkit Felix Tsui (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a waveguide and an optical attenuator. The waveguide is disposed over an insulating layer and configured to guide light. The optical attenuator is connected to the waveguide. The optical attenuator has a first surface and...