ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,865, issued on Feb. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsin-Chu, Taiwan).
"Integrated circuit structure" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Jui-Pin Hung (Hsinchu, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure and method of forming is provided. A die is placed on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from...