US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 18 for "Wafer level package with polymer layer delamination prevention design and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,593, issued on Feb. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer level package with polymer layer delamination prevention design and method of forming the same" was invented by Kai-Heng Chen (New Taipei, Taiwan), Pei-Haw Tsao (Tai-chung, Taiwan), Shyue-Ter Leu (Hsinchu, Taiwan), Rung-De Wang (Taoyuan, Taiwan) and Chien-Chun Wang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided, including a substrate, a first passivation layer, a metallization layer, a second passivation layer, and a polymer layer. The first passivation layer is formed over the substrate. ...