US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 18 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,567, issued on Feb. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Wei-Ren Wang (New Taipei, Taiwan), Tze-Liang Lee (Hsinchu, Taiwan) and Jen-Hung Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first dielectric layer, a first conductive feature, a second conductive feature, a first etch stop layer, and a conductive via. The first conductive feature and the second conductive feature are embedded in the first dielectric layer. The first etch stop layer is disposed over the ...