ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,589, issued on Feb. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Chi-Yang Yu (Taoyuan, Taiwan), Jung-Wei Cheng (Hsinchu, Taiwan), Yu-Min Liang (Taoyuan, Taiwan), Jiun-Yi Wu (Taoyuan, Taiwan), Yen-Fu Su (Hsinchu, Taiwan), Chien-Chang Lin (New Taipei, Taiwan) and Hsin-Yu Pan (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring stru...