US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 18 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,534, issued on Feb. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Tai-I Yang (Hsinchu, Taiwan), Wei-Chen Chu (Taichung, Taiwan), Yung-Chih Wang (Taoyuan, Taiwan), Chia-Tien Wu (Taichung, Taiwan), Hsin-Ping Chen (Hsinchu County, Taiwan) and Shau-Lin Shue (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a sec...