US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 18 for "Method of manufacturing semiconductor devices using directional process" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,507, issued on Feb. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor devices using directional process" was invented by Ya-Wen Yeh (Taipei, Taiwan), Yu-Tien Shen (Tainan, Taiwan), Shih-Chun Huang (Hsinchu, Taiwan), Po-Chin Chang (Taichung, Taiwan), Wei-Liang Lin (Hsinchu, Taiwan), Yung-Sung Yen (New Taipei, Taiwan), Wei-Hao Wu (Hsinchu, Taiwan), Li-Te Lin (Hsinchu, Taiwan), Pinyen Lin (Rochester, N.Y.) and Ru-Gun Liu (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, an underlying structure is formed over a su...