US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 17 for "Package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,698, issued on Feb. 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and manufacturing method thereof" was invented by Der-Chyang Yeh (Hsin-Chu, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Jian-Wei Hong (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package is provided. The method includes the following steps. A wafer substrate having first bonding pads is provided. A die is placed on the wafer substrate, wherein the die comprises second bonding pads bonded to the first bonding pads. The die is encapsulated by an etch stop layer and a first encapsulant. A redistr...