US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 11 for "Fan-out package having a main die and a dummy die" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,247, issued on Feb. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Fan-out package having a main die and a dummy die" was invented by Yan-Fu Lin (Zhubei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Meng-Tsan Lee (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan) and Hsien-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the du...