ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,276, issued on Feb. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"3D semiconductor packages" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan), Kuo-Chung Yee (Taoyuan, Taiwan) and Liang-Ju Yen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die, a first heat conduction block and a first encapsulant. The first die has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first heat conduction block has a bottom surface, a top surface and a sidewall between the bottom surface and ...