US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Wafer-level die singulation using buried sacrificial structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,414, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer-level die singulation using buried sacrificial structure" was invented by Hung-Te Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor wafers and methods of fabricating the same are provided. An example semiconductor wafer has multiple die regions separated by a die spacing region and includes a wafer substrate, multiple dies disposed over the wafer substrate, and multiple buried sacrificial structures corresponding to the multiple dies. Each die is located in the corresponding die region and further includes a d...