US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Wafer edge trimming process including water jet and wedge separation and methods thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,652, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Wafer edge trimming process including water jet and wedge separation and methods thereof" was invented by Fang-I Chen (New Taipei, Taiwan), Pei-Keng Tsai (New Taipei, Taiwan) and Hui-Chi Huang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of trimming a wafer includes securing the wafer on a top surface of a wafer chuck of a wafer edge trimming apparatus, directing a water jet at an edge of the wafer to form a plurality of cracks at uniform intervals along the edge of the wafer, inserting a wedge of a removal module into a...