ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,737, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package and method" was invented by Yu-Ling Tsai (Hsinchu, Taiwan), Lai Wei Chih (Hsinchu, Taiwan), Meng-Tsan Lee (Hsinchu, Taiwan), Hung-Pin Chang (New Taipei, Taiwan), Li-Han Hsu (Hsinchu, Taiwan), Chien-Chia Chiu (Zhongli, Taiwan) and Cheng-Hung Lin (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, whe...