ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,710, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd (Hsinchu, Taiwan).
"Semiconductor die" was invented by Yen-Kun Lai (New Taipei, Taiwan), Chien-Hao Hsu (Hsinchu County, Taiwan), Wei-Hsiang Tu (Hsinchu, Taiwan), Kuo-Chin Chang (Chiayi, Taiwan) and Mirng-Ji Lii (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked ...