US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 10 for "Method for forming a package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,769, issued on Feb. 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for forming a package structure" was invented by Kai Jun Zhan (Taoyuan, Taiwan), Chang-Jung Hsueh (Taipei, Taiwan), Hui-Min Huang (Taoyuan, Taiwan), Wei-Hung Lin (Xinfeng Township, Hsinchu County, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a package structure is provided. The method includes transporting a first package component into a processing chamber. The method includes positioning the first package component on a chuck table. The method includes using the chuck t...