US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 10 for "Magnetic polishing slurry and method for polishing a workpiece" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,810, issued on Feb. 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Magnetic polishing slurry and method for polishing a workpiece" was invented by Ji Cui (Bolingbrook, Ill.), Chih Hung Chen (Hsinchu, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A magnetic polishing slurry for polishing a workpiece includes magnetic particles coated with a modifying material, a liquid carrier, and abrasives. The modifying material has a hardness lower than that of the workpiece."

The patent was filed on Jan. 5, 2021, under Application No. 17/141,948.

*For further information, includ...