US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,784, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Chun-Jen Chen (Jhubei, Taiwan), Wei-Chun Pai (Hsinchu, Taiwan), Cheng Wei Ho (Taoyuan, Taiwan) and Sheng-Huan Chiu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: an integrated circuit die including a die connector; a dielectric layer on the integrated circuit die; an under-bump metallurgy layer having a line portion on the dielectric layer and having a via portion extending through the dielectric layer to contact the ...