US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Integrated circuit package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,935, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Wen-Hao Cheng (Hsinchu, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan) and Chung-Hao Tsai (Huatan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes an encapsulant having a first side and a second side opposite to the first side, a first integrated circuit die and a second integrated circuit die embedded in the encapsulant, and a first interposer on the first side of the encapsulant. ...