ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,757, issued on Feb. 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Chip package structure" was invented by Shin-Puu Jeng (Hsinchu, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan), Feng-Cheng Hsu (New Taipei, Taiwan) and Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first redistribution structure having a first surface and a second surface. The first redistribution structure includes a first pad and a second pad, the first pad is adjacent to the first surface, and the second pad is adja...