US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Stacked wafer structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,359, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stacked wafer structure and method for forming the same" was invented by Yu-Chen Chang (Hsinchu County, Taiwan), Chien-Wen Lai (Hsinchu, Taiwan) and Chih-Min Hsiao (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a front side surface of a first wafer to a front side of a second wafer; forming a bonding material on a periphery of the first wafer and a periphery of the second wafer; performing a thinning process on the first wafer from a back side surface of the first wafer; after performing the thinning proces...