US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Semiconductor structure and method for forming the semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,422, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the semiconductor structure" was invented by Chih-Pin Chiu (Hsinchu, Taiwan), Liang-Wei Wang (Hsinchu, Taiwan), Chen-Chiu Huang (Taichung, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure includes forming a metal-insulator-metal (MIM) structure between first passivation layers over a substrate. The method also includes forming a via structure through the MIM structure and the first passivation layers. The method ...