ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,401, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package and method" was invented by Yi-Huan Liao (Hsinchu, Taiwan), Ping-Yin Hsieh (Hsinchu, Taiwan), Chih-Hao Chen (Taipei, Taiwan), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer...