US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Semiconductor device and method of manufacturing same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,536, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing same" was invented by Kang-Yi Lien (Tainan, Taiwan), Kuan-Chi Tsai (Kaohsiung, Taiwan), Yi-Chieh Huang (Tainan, Taiwan), Wei-Tung Huang (Tainan, Taiwan) and Hsiang-Fu Chen (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacturing the device that includes a capacitive micromachined ultrasonic transducer (CMUT). The CMUT includes an integrated circuit substrate, and a sensing electrode positioned on the integrated substrate. The sensing electro...