US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Multiple pattern metal fuse device, layout, and method" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,731, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Multiple pattern metal fuse device, layout, and method" was invented by Hsiang-Wei Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a transistor and a metal fuse structure including a metal fuse electrically connected to the transistor, and a first metal line in parallel with the metal fuse and adjacent to a first portion of the metal fuse in a first direction. The first portion has a first width, and the metal fuse includes a second portion having a second width larger than the first...