US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Integrated circuit and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,411, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit and method of forming the same" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Chih-Min Hsiao (Hsinchu, Taiwan), Chia-Tien Wu (Hsinchu, Taiwan), Chien-Wen Lai (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a first active region, a first contact, a first gate, a first conductive line, a first conductor and a first via. In some embodiments, the first active region extends in a first direction. In some embodiments, the first contact extends i...