US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Heterogeneous bonding structure and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,379, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Heterogeneous bonding structure and method forming same" was invented by Mirng-Ji Lii (Sinpu Township, Taiwan), Chen-Shien Chen (Zhubei, Taiwan), Lung-Kai Mao (Kaohsiung, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan) and Wen-Hsiung Lu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process...