US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow region" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,405, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow region" was invented by Yung-Chi Chu (Kaohsiung, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan) and Tian Hu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes: laterally covering a sensing die with an encapsulant, where the encapsulant includes a top surface and a rounded inner edge connected to the top surface, a...