US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 30 for "Wafer bonding method and semiconductor structure obtained by the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,439, issued on Dec. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Wafer bonding method and semiconductor structure obtained by the same" was invented by Zheng-Yong Liang (Hsinchu, Taiwan), Wei-Ting Yeh (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan) and Keng-Chu Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure includes: forming a first bonding layer on a device substrate formed with a semiconductor device so as to cover the semiconductor device, wherein the first bonding layer includes a first metal oxide material in an amorphous state;...