US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 30 for "Semiconductor structures and methods for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,433, issued on Dec. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structures and methods for manufacturing the same" was invented by Chih-Pin Chiu (Hsinchu, Taiwan), Liang-Wei Wang (Hsinchu, Taiwan), Chen-Chiu Huang (Taichung, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed semiconductor device manufacturing processes improve the flatness of a passivation layer deposited above a redistribution layer (RDL). When a thin passivation layer is deposited above the RDL, its top surface tends to become very uneven due to the large gaps that typically ...