US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 30 for "Semiconductor structure with testing pads and method of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,372, issued on Dec. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure with testing pads and method of manufacturing thereof" was invented by Chih-Hsuan Tai (Taipei, Taiwan), Yu-Wei Chiu (Pingtung County, Taiwan), Kuo Wen Chen (Hsinchu, Taiwan) and Hsiang-Tai Lu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor structure, comprising: disposing a dielectric layer over a semiconductive wafer defined with a plurality of active regions and a scribe line region surrounding each of the plurality of active regions; forming a plurality...