US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Semiconductor structure, stacked structure with terminal comprising capping layer and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,440, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure, stacked structure with terminal comprising capping layer and manufacturing method thereof" was invented by Wei-Chung Chang (Taipei, Taiwan), Ming-Che Ho (Tainan, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redist...