US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Semiconductor package with electrically conductive structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,384, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with electrically conductive structure and manufacturing method thereof" was invented by Kai-Fung Chang (Taipei, Taiwan), Sheng-Feng Weng (Taichung, Taiwan), Ming-Yu Yen (MiaoLi County, Taiwan), Kai-Ming Chiang (Taichung, Taiwan), Wei-Jhan Tsai (Kaohsiung, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution circuit structure, a semiconductor die, and an electrically conductive structure. The s...