US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,405, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Tzu-Chun Tang (Kaohsiung, Taiwan), Chung-Hao Tsai (Changhua County, Taiwan) and Chuei-Tang Wang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a first die and a second die bonded to the first die. An encapsulant laterally encapsulates the second die. Through vias are disposed in the encapsulant. An interconnect structure is disposed on the second die, the through vias and the encapsul...