US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Semiconductor package and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,399, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacture" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices having improved under-bump metallization layouts and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes an IC die; an interconnect structure coupled to the IC die and includin...