US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Semiconductor package and manufacturing method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,451, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method of the same" was invented by Mao-Yen Chang (Kaohsiung, Taiwan), Chun-Cheng Lin (New Taipei, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan), Yi-Da Tsai (Chiayi Country, Taiwan), Hsaing-Pin Kuan (Hsinchu, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Hsuan-Ting Kuo (Taichung, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Yu-Chia Lai (Hsinchu, Taiwan), Kuo-Lung Pan (Miaoli County, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A...