US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 30 for "Semiconductor device with flexible sheet structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,962, issued on Dec. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with flexible sheet structure" was invented by Chun-Yen Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and the manufacturing method thereof are disclosed. An exemplary manufacturing method includes patterning a top portion of a substrate, thereby forming a fin-like structure protruding from the substrate, forming a dummy gate structure across the fin-like structure, the dummy gate structure being directly above the first portion and the second portion of the fin-like structure,...